Semiconductor manufacturing tools: flat rings / dicing rings
Complex hollow shapes can also be processed in aluminum.
This is a tool used in the dicing process of silicon wafers, made from aluminum extruded pipes and stainless steel plates (SUS420J2). After plate processing and precision pressing, various surface treatments are applied according to specific requirements, including anodizing, hard anodizing, electroless nickel plating (Kanizen plating), and metal coating. There is no initial cost for basic shapes. We will provide optimal proposals based on your requests, such as "I want to change the inner cutout" or "I want to improve the surface slip properties." For more details, please contact us or refer to the catalog.
- Company：UACJグループ 泉メタル株式会社
- Price：Other
